研究班：B01-3
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Masatsugu Nimura, Akitsu Shigetou, et al.
Best Presentation Award
Hybrid Solder-Adhesive Bonding Using Simple Resin Planarization Technique for 3D LSI
IEEE CPMT Japan Society (2012.05.22) -
Akitsu Shigetou and Ajayan Mano
Best poster conference paper(Second Place)
UV/Vapor-Assisted Hybrid Bonding as a Tool for Future Nanopackaging
IEEE (2012.08.22) -
Benjamin Masheder, Atsushi Hozumi
IPC2012 Young Scientist Poster Award
A Novel One-Pot Zirconium-Organic Hybrid Layered Material with Excellent Transparency and Oleophobic Dewettability
The 9th SPSJ International Polymer Conference（Kobe Convention Center, Japan） (2012.12.14)